Suchergebnisse - "Yang, Dongwang"

PubPharm (22)

1

Dual-Cation CuAgSe-Based Material : Rapid Mass Transfer in Synthesis and High Thermoelectric Performance Realization

enthalten in: ACS applied materials & interfaces | 2024

von Jia, Y. | Yang, D. | Zhang, M. | +9

2

The Failure Mechanism of Micro Thermoelectric Devices under the Action of the Temperature Field

enthalten in: ACS applied materials & interfaces | 2024

von Lyu, J. | Yang, D. | Liu, Y. | +10

3

Objective evaluation of wearable thermoelectric generator : From platform building to performance verification

enthalten in: The Review of scientific instruments | 2022

von Xu, Z. | Yang, D. | Yuan, X. | +8

4

Enhanced Thermoelectric Properties of Cu2SnSe3-Based Materials with Ag2Se Addition

enthalten in: ACS applied materials & interfaces | 2022

von Cheng, X. | Zhu, B. | Yang, D. | +5

5

Correction to "Enhancing the Thermoelectric and Mechanical Properties of Bi0.5Sb1.5Te3 Modulated by the Texture and Dense Dislocation Networks"

enthalten in: ACS applied materials & interfaces | 2022

von Qiu, J. | Luo, T. | Yan, Y. | +8

ErratumFor: ACS Appl Mater Interfaces. 2021 Dec 15;13(49):58974-58981. - PMID 34854669

6

A Flash Vacuum‐Induced Reaction in Preparing High Performance Thermoelectric Cu2 S

enthalten in: Advanced Functional Materials | 2022

von Yu, Y. | Yang, D. | Li, J. | +7

7

Preparation and In‐Situ High‐Throughput Screening of Bi Thixotropic Ink

enthalten in: Advanced Materials Interfaces | 2022

von Yao, L. | Xu, Z. | Qiu, J. | +4

8

Enhancing the Thermoelectric and Mechanical Properties of Bi0.5Sb1.5Te3 Modulated by the Texture and Dense Dislocation Networks

enthalten in: ACS applied materials & interfaces | 2021

von Qiu, J. | Luo, T. | Yan, Y. | +8

ErratumIn: ACS Appl Mater Interfaces. 2022 Jan 12;14(1):2426. - PMID 34962772

9

Electroresistance in multipolar antiferroelectric Cu2Se semiconductor

enthalten in: Nature communications | 2021

von Bai, H. | Wu, J. | Su, X. | +6

10

Synergistically Enhanced Thermoelectric Performance of Cu2SnSe3-Based Composites via Ag Doping Balance

enthalten in: ACS applied materials & interfaces | 2021

von Cheng, X. | Yang, D. | Su, X. | +4