Suchergebnisse - "Springer International Publishing"

131

Imaging in Geriatrics

Erschienen: Cham, Springer International Publishing AG, 2024

Practical Issues in Geriatrics

1st ed. 2023

von Guglielmi, G. | Maas, M.

132

Advances in Non-Invasive Biomedical Signal Sensing and Processing with Machine Learning

Erschienen: Cham, Springer International Publishing AG, 2024

1st ed. 2023

von Nisar, H. | Qaisar, S. | Subasi, A.

133

Sex Differences in Brain Function and Dysfunction

Erschienen: Cham, Springer International Publishing AG, 2024

Current Topics in Behavioral Neurosciences

1st ed. 2023

von Galea, L. | Gibson, C.

134

Fundamentals of Surface Thermodynamics : Phase Behavior and Its Related Properties

Erschienen: Cham, Springer International Publishing, 2024.

1st ed. 2024.

von dos Santos, R.

135

Ecology of Wildlife Diseases in the Neotropics

Erschienen: Cham, Springer International Publishing, 2024.

1st ed. 2024.

von Acosta-Jamett, G. | Chaves, A.

136

Applications of Generative AI

Erschienen: Cham, Springer International Publishing, 2024.

1st ed. 2024.

von Lyu, Z.

137

Food Engineering Principles and Practices : A One-Semester Course

Erschienen: Cham, Springer International Publishing, 2024.

1st ed. 2024.

von Rizvi, S.

138

Multiplicity of Time Scales in Complex Systems : Challenges for Sciences and Communication I

Erschienen: Cham, Springer International Publishing, 2024.

Mathematics Online First Collections

1st ed. 2024.

von Booß-Bavnbek, B. | Hesselbjerg Christensen, J. | Richardson, K. | +1

139

Endophytic Fungi : The Hidden Sustainable Jewels for the Pharmaceutical and Agricultural Industries

Erschienen: Cham, Springer International Publishing, 2024

Fungal Biology

von Singh, B. | Abdel-Azeem, A. | Gautam, V. | +2

140

6GN for Future Wireless Networks : 6th EAI International Conference, 6GN 2023, Shanghai, China, October 7-8, 2023, Proceedings, Part II

Erschienen: Cham, Springer International Publishing AG, 2024

Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering

von Li, J. | Ying, Y. | Zhang, B.

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