Suchergebnisse - "Zhang, Xingkai"

PubPharm (54)

1

Temperature-Dependent Frictional Behavior of MoS2 in Humid Environments : Insights from Water Molecule Adsorption and DFT Analyses

enthalten in: ACS applied materials & interfaces | 2024

von Yang, Z. | Zhang, X. | Gao, K. | +5

2

Experimental Evaluation of Anticorrosion of a Standard 20# Gathering Pipeline by Injecting Oxygen-Reduced Air into Simulated In-Service Wells

enthalten in: ACS omega | 2024

von Hu, Z. | Xue, K. | Shi, B. | +5

3

Targeted Protein Fate Modulating Functional Microunits Promotes Intervertebral Fusion

enthalten in: Small methods | 2023

von Zheng, J. | Zhao, J. | Li, C. | +7

4

Comparison of effectiveness of lower extremity axial distractor and traction table assisted closed reduction and intramedullary nail fixation in femoral subtrochanteric fracture

enthalten in: Zhongguo xiu fu chong jian wai ke za zhi = Zhongguo xiufu chongjian waike zazhi = Chinese journal of reparative and reconstructive surgery | 2023

von Zhang, X. | Zhou, N. | Ma, M. | +4

5

Construction method of composite film on surface of rubber dynamic sealing element

enthalten in: Europäisches Patentamt | 2023

von BAI CHANGNING | ZHANG JUNYAN | ZHANG XINGKAI | +2

6

Study on the Corrosion Mechanism of N80 Steel in Simulated Oxygen-Reduced Air Drive Production Wellbores

enthalten in: ACS omega | 2023

von Shi, B. | Wang, X. | Zhou, K. | +4

7

Preparation method of copper seed layer of polymer composite copper foil

enthalten in: Europäisches Patentamt | 2023

von ZHANG JUNYAN | ZHANG GUANG'AN | ZHANG XINGKAI | +1

8

Application of Ilizarov technique on the treatment of radius bone defect after open fracture

enthalten in: Asian journal of surgery | 2023

von Zhou, N. | Zhang, X. | Wang, Z. | +1

9

An Integrated Quantitative Risk Assessment Method for Underground Engineering Fires

enthalten in: International journal of environmental research and public health | 2022

von Yuan, Q. | Zhu, H. | Zhang, X. | +2

10

Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating

enthalten in: Journal of solid state electrochemistry | 2022

von Hu, G. | Huang, R. | Wang, H. | +2

1
2
3
4
5
6
Nächster »
[6]