Suchergebnisse - "Tu, King-Ning"

PubPharm (35)

1

Measurement of Thermal Stress by X-ray Nano-Diffraction in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO2 Hybrid Joints

enthalten in: Nanomaterials (Basel, Switzerland) | 2023

von Hsu, W. | Yang, S. | Lin, Y. | +6

2

Twin-Boundary Reduced Surface Diffusion on Electrically Stressed Copper Nanowires

enthalten in: Nano letters | 2022

von Weng, W. | Chen, H. | Ting, Y. | +4

3

Uphill Diffusion Induced Point Contact Reaction in Si Nanowires

enthalten in: Nano letters | 2022

von Chou, Y. | Chen, L. | Tu, K.

4

Artificial intelligence deep learning for 3D IC reliability prediction

enthalten in: Scientific reports | 2022

von Hsu, P. | Shie, K. | Chen, K. | +9

5

Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces

enthalten in: Materials (Basel, Switzerland) | 2022

von Ong, J. | Chiu, W. | Lee, O. | +8

6

Tensile Properties of <111>-Oriented Nanotwinned Cu with Different Columnar Grain Structures

enthalten in: Materials (Basel, Switzerland) | 2020

von Li, Y. | Tu, K. | Chen, C.

7

Tensile Properties and Thermal Stability of Unidirectionally <111>-Oriented Nanotwinned and <110>-Oriented Microtwinned Copper

enthalten in: Materials (Basel, Switzerland) | 2020

von Li, Y. | Tu, K. | Chen, C.

8

Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation

enthalten in: Scientific reports | 2017

von Chang, Y. | Cheng, Y. | Helfen, L. | +7

9

Intermetallic compounds in 3D integrated circuits technology : a brief review

enthalten in: Science and technology of advanced materials | 2017

von Annuar, S. | Mahmoodian, R. | Hamdi, M. | +1

10

近十年中国无铅钎料研究进展 : = Development of lead-free solders in China during the past decade

enthalten in: Zhong guo ke xue. Ji shu ke xue | 2016-08-20

China Academic Journals (CAJ), C, 理工C(机电航空交通水利建筑能源) = Architecture/ Energy/ Traffic/ Electromechanics, etc

von 张亮 | TU KingNing | 陈信文 | +5