Suchergebnisse - "HAO YANGFAN"

PubPharm (14)

1

Genetic and transcriptomic dissection of host defense to Goss's bacterial wilt and leaf blight of maize

enthalten in: G3 (Bethesda, Md.) | 2023

von Hao, Y. | Hu, Y. | Jaqueth, J. | +12

2

Using recurrent neural networks to detect supernumerary chromosomes in fungal strains causing blast diseases

enthalten in: bioRxiv.org | 2023

von Gyawali, N. | Hao, Y. | Lin, G. | +9

3

Pharmaceutical composition capable of effectively preventing SN triple bond structure compound from inactivating and enhancing targeting activity

enthalten in: Europäisches Patentamt | 2023

von HAO WEI | HAO YANGFAN | QIAO YALI

4

Pharmaceutical composition capable of effectively preventing SN triple bond structure compound from inactivating and enhancing targeting activity

enthalten in: Europäisches Patentamt | 2023

von HAO WEI | HAO YANGFAN | QIAO YALI

5

PHARMACEUTICAL COMPOSITION CAPABLE OF EFFECTIVELY PREVENTING SN TRIPLE BOND STRUCTURE COMPOUND FROM BEING DEACTIVATED, AND ENHANCING TARGETED ACTIVITY

enthalten in: Europäisches Patentamt | 2023

von HAO WEI | HAO YANGFAN | QIAO YALI

6

Chromosome-level Genome Assembly of a Regenerable Maize Inbred Line A188

enthalten in: bioRxiv.org | 2022

von Lin, G. | He, C. | Zheng, J. | +24

7

Redox-engineering enhances maize thermotolerance and grain yield in the field

enthalten in: Plant biotechnology journal | 2022

von Sprague, S. | Tamang, T. | Steiner, T. | +23

8

Development of a Model for Genomic Prediction of Multiple Traits in Common Bean Germplasm, Based on Population Structure

enthalten in: Plants (Basel, Switzerland) | 2022

von Shao, J. | Hao, Y. | Wang, L. | +5

9

Integration of genomic selection with doubled-haploid evaluation in hybrid breeding : From GS 1.0 to GS 4.0 and beyond

enthalten in: Molecular plant | 2022

von Fu, J. | Hao, Y. | Li, H. | +7

10

Redox‐engineering enhances maize thermotolerance and grain yield in the field

enthalten in: Plant Biotechnology Journal | 2022

von Sprague, S. | Tamang, T. | Steiner, T. | +23