Optimization of the Thermally Conductive Low-k Polymer Dielectrics Based on Multisource Free-Volume Effects
Polymers/polymer matrix composites possessing low dielectric constants (low-k polymer dielectrics) contribute to the advance of electronics, for instance, microprocessor chips, mobile phone antennas, and data communication terminals. However, the intrinsic long-chain structural characteristic results in poor thermal conductivities, which draw heat accumulation and undermine the outstanding low-k performance of polymers. Herein, multisource free-volume effects that combine two novel kinds of extra free volume with the known in-cage free volume of polyhedral oligomeric silsesquioxanes (POSSs) are discussed to reduce the capacity for dielectric constant reduction. The multisource free-volume effects of POSSs are associated with the thermal conductive network formed by the hexagonal boron nitride (BN) in the polymer matrix. The results show a decent balance between low-k performance (dielectric constant is 2.08 at 1 MHz and 1.98 at 10 GHz) and thermal conductivity (0.555 W m-1 K-1, 4.91 times the matrix). The results provide a new idea to maximize the free-volume effects of POSSs to optimize dielectric properties together with other desired performances for the dielectrics.
| Medienart: |
E-Artikel |
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| Erscheinungsjahr: |
2024 |
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| Erschienen: |
2024 |
| Enthalten in: |
Zur Gesamtaufnahme - volume:16 |
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| Enthalten in: |
ACS applied materials & interfaces - 16(2024), 13 vom: 03. Apr., Seite 16809-16819 |
| Sprache: |
Englisch |
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| Beteiligte Personen: |
Xu, Weidi [VerfasserIn] |
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| Links: |
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| Themen: |
Cyclic olefin copolymers |
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| Anmerkungen: |
Date Revised 04.04.2024 published: Print-Electronic Citation Status PubMed-not-MEDLINE |
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| doi: |
10.1021/acsami.4c00553 |
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| funding: |
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| Förderinstitution / Projekttitel: |
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| PPN (Katalog-ID): |
NLM369925106 |
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| 520 | |a Polymers/polymer matrix composites possessing low dielectric constants (low-k polymer dielectrics) contribute to the advance of electronics, for instance, microprocessor chips, mobile phone antennas, and data communication terminals. However, the intrinsic long-chain structural characteristic results in poor thermal conductivities, which draw heat accumulation and undermine the outstanding low-k performance of polymers. Herein, multisource free-volume effects that combine two novel kinds of extra free volume with the known in-cage free volume of polyhedral oligomeric silsesquioxanes (POSSs) are discussed to reduce the capacity for dielectric constant reduction. The multisource free-volume effects of POSSs are associated with the thermal conductive network formed by the hexagonal boron nitride (BN) in the polymer matrix. The results show a decent balance between low-k performance (dielectric constant is 2.08 at 1 MHz and 1.98 at 10 GHz) and thermal conductivity (0.555 W m-1 K-1, 4.91 times the matrix). The results provide a new idea to maximize the free-volume effects of POSSs to optimize dielectric properties together with other desired performances for the dielectrics | ||
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| 650 | 4 | |a dielectric constant | |
| 650 | 4 | |a low-k polymer dielectrics | |
| 650 | 4 | |a multisource free-volume effects | |
| 650 | 4 | |a thermal conductivity | |
| 700 | 1 | |a Wang, Ziyang |e verfasserin |4 aut | |
| 700 | 1 | |a Cao, Hong |e verfasserin |4 aut | |
| 700 | 1 | |a Zhou, Ling |e verfasserin |4 aut | |
| 700 | 1 | |a Jiang, Niu |e verfasserin |4 aut | |
| 700 | 1 | |a Ke, Kai |e verfasserin |4 aut | |
| 700 | 1 | |a Liu, Zhengying |e verfasserin |4 aut | |
| 700 | 1 | |a Yang, Wei |e verfasserin |4 aut | |
| 700 | 1 | |a Yang, Mingbo |e verfasserin |4 aut | |
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