Silicon Hybridization for the Preparation of Room-Temperature Curing and High-Temperature-Resistant Epoxy Resin

Specialized epoxy resin, capable of achieving room-temperature profound curing and sustaining prolonged exposure to high-temperature environments, stands as a pivotal material in modern high-end manufacturing sectors including aerospace, marine equipment fabrication, machinery production, and the electronics industry. Herein, a silicon-hybridized epoxy resin, amenable to room-temperature curing and designed for high-temperature applications, was synthesized using a sol-gel methodology with silicate esters and silane coupling agents serving as silicon sources. Resin characterization indicates a uniform distribution of silicon elements in the obtained silicon hybrid epoxy resin. In comparison to the non-hybridized epoxy resin, notable improvements are observed in room-temperature curing performance, heat resistance, and mechanical strength.

Medienart:

E-Artikel

Erscheinungsjahr:

2024

Erschienen:

2024

Enthalten in:

Zur Gesamtaufnahme - volume:16

Enthalten in:

Polymers - 16(2024), 5 vom: 27. Feb.

Sprache:

Englisch

Beteiligte Personen:

Rong, Liping [VerfasserIn]
Su, Jiaqi [VerfasserIn]
Li, Zhiguo [VerfasserIn]
Liu, Xiaohui [VerfasserIn]
Zhang, Dayong [VerfasserIn]
Zhu, Jinhua [VerfasserIn]
Li, Xin [VerfasserIn]
Zhao, Ying [VerfasserIn]
Mi, Changhong [VerfasserIn]
Kong, Xianzhi [VerfasserIn]
Wang, Gang [VerfasserIn]

Links:

Volltext

Themen:

Adhesive
Heat resistance
Journal Article
Room-temperature curing
Silicon-hybridized epoxy resin
Sol–gel method

Anmerkungen:

Date Revised 15.03.2024

published: Electronic

Citation Status PubMed-not-MEDLINE

doi:

10.3390/polym16050634

funding:

Förderinstitution / Projekttitel:

PPN (Katalog-ID):

NLM369650328