Advanced Three-Dimensional Microelectrode Architecture Design for High-Performance On-Chip Micro-Supercapacitors

The rapid development of miniaturized electronic devices has greatly stimulated the endless pursuit of high-performance on-chip micro-supercapacitors (MSCs) delivering both high energy and power densities. To this end, an advanced three-dimensional (3D) microelectrode architecture design offers enormous opportunities due to high mass loading of active materials, large specific surface areas, fast ion diffusion kinetics, and short electron transport pathways. In this review, we summarize the recent advances in the rational design of 3D architectured microelectrodes including 3D dense microelectrodes, 3D nanoporous microelectrodes, and 3D macroporous microelectrodes. Furthermore, the emergent microfabrication strategies are discussed in detail in terms of charge storage mechanisms and structure-performance correlation for on-chip MSCs. Finally, we conclude with a perspective on future opportunities and challenges in this thriving field.

Medienart:

E-Artikel

Erscheinungsjahr:

2022

Erschienen:

2022

Enthalten in:

Zur Gesamtaufnahme - volume:16

Enthalten in:

ACS nano - 16(2022), 11 vom: 22. Nov., Seite 17593-17612

Sprache:

Englisch

Beteiligte Personen:

Zhang, Panpan [VerfasserIn]
Yang, Sheng [VerfasserIn]
Xie, Honggui [VerfasserIn]
Li, Yang [VerfasserIn]
Wang, Faxing [VerfasserIn]
Gao, Mingming [VerfasserIn]
Guo, Kun [VerfasserIn]
Wang, Renheng [VerfasserIn]
Lu, Xing [VerfasserIn]

Links:

Volltext

Themen:

3D microelectrodes
Architecture design
Conductive scaffold
Energy density
Energy storage
Journal Article
Long-term stability
On-chip micro-supercapacitors
Power density
Review

Anmerkungen:

Date Revised 28.11.2022

published: Print-Electronic

Citation Status PubMed-not-MEDLINE

doi:

10.1021/acsnano.2c07609

funding:

Förderinstitution / Projekttitel:

PPN (Katalog-ID):

NLM348811306