QUANTUM DEVICES AND METHODS FOR MAKING THE SAME
The present disclosure relates to structures and methods of quantum devices. A quantum device comprises a substrate with an insulation surface and at least one quantum component disposed on the insulation surface of the substrate. The at least one quantum component may comprise multiple plateau members and at least one quantum dot. Each plateau member is disposed at an angle against an adjacent plateau member. Each quantum dot is formed within an insulation body and disposed at an included-angle location of two adjacent plateau members of the multiple plateau members. In addition, the at least one quantum component is operable under high temperature, such as above 4 K..
Medienart: |
Patent |
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Erscheinungsjahr: |
2023 |
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Erschienen: |
2023 |
Enthalten in: |
Europäisches Patentamt - (2023) vom: 30. Nov. Zur Gesamtaufnahme - year:2023 |
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Sprache: |
Englisch |
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Beteiligte Personen: |
LI PEI-WEN [VerfasserIn] |
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Links: |
Volltext [kostenfrei] |
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Anmerkungen: |
Source: www.epo.org (no modifications made), First posted: 2023-11-30, Last update posted on www.tib.eu: 2024-01-02, Last updated: 2024-01-05 |
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Patentnummer: |
US2023389346 |
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Förderinstitution / Projekttitel: |
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PPN (Katalog-ID): |
EPA018734820 |
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520 | |a The present disclosure relates to structures and methods of quantum devices. A quantum device comprises a substrate with an insulation surface and at least one quantum component disposed on the insulation surface of the substrate. The at least one quantum component may comprise multiple plateau members and at least one quantum dot. Each plateau member is disposed at an angle against an adjacent plateau member. Each quantum dot is formed within an insulation body and disposed at an included-angle location of two adjacent plateau members of the multiple plateau members. In addition, the at least one quantum component is operable under high temperature, such as above 4 K. | ||
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