Low Sintering Temperature Nano-Silver Pastes with High Bonding Strength by Adding Silver 2-Ethylhexanoate
A silver precursor (silver 2-ethylhexanoate) and silver nanoparticles were synthesized and used to prepare a low sintering temperature nano-silver paste (PM03). We optimized the amount of silver 2-ethylhexanoate added and the sintering temperature to obtain the best performance of the nano-silver paste. The relationship between the microstructures and properties of the paste was studied. The addition of silver 2-ethylhexanoate resulted in less porosity, leading to lower resistivity and higher shear strength. Thermal compression of the paste PM03 at 250 °C with 10 MPa pressure for 30 min was found to be the proper condition for copper-to-copper bonding. The resistivity was (3.50 ± 0.02) × 10-7 Ω∙m, and the shear strength was 57.48 MPa.
| Medienart: |
E-Artikel |
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| Erscheinungsjahr: |
2021 |
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| Erschienen: |
2021 |
| Enthalten in: |
Zur Gesamtaufnahme - volume:14 |
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| Enthalten in: |
Materials (Basel, Switzerland) - 14(2021), 20 vom: 10. Okt. |
| Sprache: |
Englisch |
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| Beteiligte Personen: |
Hsu, Steve Lien-Chung [VerfasserIn] |
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| Links: |
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| Themen: |
Copper-to-copper bonding |
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| Anmerkungen: |
Date Revised 26.10.2021 published: Electronic Citation Status PubMed-not-MEDLINE |
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| doi: |
10.3390/ma14205941 |
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| funding: |
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| Förderinstitution / Projekttitel: |
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| PPN (Katalog-ID): |
NLM332236803 |
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| 500 | |a Citation Status PubMed-not-MEDLINE | ||
| 520 | |a A silver precursor (silver 2-ethylhexanoate) and silver nanoparticles were synthesized and used to prepare a low sintering temperature nano-silver paste (PM03). We optimized the amount of silver 2-ethylhexanoate added and the sintering temperature to obtain the best performance of the nano-silver paste. The relationship between the microstructures and properties of the paste was studied. The addition of silver 2-ethylhexanoate resulted in less porosity, leading to lower resistivity and higher shear strength. Thermal compression of the paste PM03 at 250 °C with 10 MPa pressure for 30 min was found to be the proper condition for copper-to-copper bonding. The resistivity was (3.50 ± 0.02) × 10-7 Ω∙m, and the shear strength was 57.48 MPa | ||
| 650 | 4 | |a Journal Article | |
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| 650 | 4 | |a low temperature sintering | |
| 650 | 4 | |a nano-silver pastes | |
| 650 | 4 | |a silver nanoparticles | |
| 650 | 4 | |a silver precursor | |
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| 700 | 1 | |a Chen, In-Gann |e verfasserin |4 aut | |
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